RoHS/REACH
Pyramid Semiconductor understands compliance to Environment, Health & Safety regulations and implements it in every relevant area of the manufacturing process.
We provide solutions compliant to RoHS Directive 2011/65/EU, 2015/863 and REACH Regulation EC 1907/2006 and EU 2022/477 in our Lead Free semiconductor product offerings, which have an "LF" suffix at the end of the standard part number.
View our RoHS/REACH Statement
Our Standard Products are offered in a variety of different plastic and hermetic ceramic packages with the following solder dip material composition:
- ~ 63% Tin (Sn)
- ~ 37% Lead (Pb)
For our Lead Free products in compliance with Restriction of Hazardous Substances (RoHS) Directive and Registration, Evaluation, Authorization and Restriction of Chemicals (REACH):
Lead Free products are RoHS-10/REACH compliant, and have less than the following limits for these restricted substances:
| Substance | Allowed |
|---|---|
| Cadmium (Cd) | < 0.01% |
| Mercury (Hg) | < 0.1% |
| Hexavalent Chromium (Hex-Cr) | < 0.1% |
| Polybrominated Biphenyls (PBB) | < 0.1% |
| Polybrominated Diphenyl Ethers (PBDE) | < 0.1% |
| Lead (Pb) | < 0.1% |
| Bis(2-Ethylhexyl) phthalate (DEHP) | < 0.1% |
| Benzyl butyl phthalate (BBP) | < 0.1% |
| Dibutyl phthalate (DBP) | < 0.1% |
| Diisobutyl phthalate (DIBP) | < 0.1% |
RoHS-10/REACH compliant devices are available in plastic packages. The composition of the leads on these devices is Matte Tin (Sn) 100%.
Some standard products can be supplied RoHS-10 compliant as special products, contact factory for more information.